LG’s upcoming flagship, the G8 ThinQ is set to be officially revealed at MWC 2019 but the company is releasing details including a Time-of-Flight (ToF) camera sensor.
The REAL3 image sensor was developed by Infineon Technologies AG and uses algorithms for processed 3D point clouds (which are a set of data points produced by 3D scanning) and help “deliver a new level of front camera capability in a smartphone.”
“Infineon is poised to revolutionize the market,” said Andreas Urschitz, division president of Infineon’s Power Management & Multimarket division. “We have demonstrated service beyond the mere product level – specifically catering to phone OEMs, associated reference design houses and camera module manufacturers. Within five years, we expect 3D cameras to be found in most smartphones and Infineon will contribute a significant share.”
The ToF image sensor uses more accurate measurements of objects by capturing infrared light as it’s reflected off a subject. ToF is not affected by light from external sources since the technology sees objects in 3D.
“Keeping in mind LG’s goal to provide real value to its mobile customers, our newest flagship was designed with ToF technology from inception to give users a unique and secure verification system without sacrificing camera capabilities,” said Chang Ma, senior vice president and head of Product Strategy at LG Mobile Communications Company. “The LG G8 ThinQ featuring ToF will be the optimal choice for users in search of a premium smartphone that offers unmatched camera capabilities.”
The LG G8 ThinQ will officially be revealed on February 24th during MWC in Barcelona.