At its second annual Snapdragon Technology Summit, Qualcomm officially revealed their next chipset, the Snapdragon 845.
The chipset is built on the 10nm processor and has a Kyro 385 CPU with eight semi-customized ARM cores, four of which are clocked at up to 2.8GHz and the other at 1.8GHz.
Some of the more significant changes include the image signal processor (ISP), with the second-gen Spectra 280. The Snapdragon 845 can support 4K video capture in HDR at 60fps, up to 16 megapixels. The chipset also includes Active Depth Sensing and 10-bit colour depth, which can produce over a billion shades of colour.
The 845 can also help improve colour gamut which in turn provides about a 70 percent increase in the choice of colours. Qualcomm’s latest chipset can help with multi-frame noise reduction and ImMotion computational photography.
The new X20 LTE Modem in the 845 has support for 1.2Gbps Gigabit LTE Category 18 and Dual SIM-Dual VoLTE. The 845 can also help with Bluetooth 5.
The 845 also brings support for Qualcomm Quick Charge 4+, so you should be able to charge your devices even faster in a shorter amount of time.
The 845 also supports Qualcomm’s third-gen AI mobile platform which can improve AI performance including “simplifying how you take pictures and videos; enhancing your VR games, and making voice interaction natural.” There is also support for Google’s TensorFlow machine learning and Facebook’s Caffe/Caffe2 frameworks.
It also supports room-scale 6-DoF (degrees of freedom), which can help when mapping out spaces in real-time.
The Snapdragon 845 will be hitting devices, such as smartphones, XR headsets, and Always Connected PCs, starting in early 2018.